In medical settings where hygiene and efficiency are paramount, selecting the right hand paper towel is crucial. The scrim reinforced hand paper towel is revolutionizing hospital and surgical practices with its unmatched strength and reliability. Designed specifically for high-stakes environments, these towels deliver superior performance, ensuring optimal cleanliness and safety during critical moments.

Why Choose Scrim Reinforced Hand Paper Towels?

Unlike conventional hand towels, scrim reinforced towels are crafted from a unique blend of pure wood pulp paper and scrim cotton mesh. This innovative combination offers several distinct advantages:

•Eco-Friendly Composition: Made with sustainable materials, these towels are biodegradable and environmentally conscious.

•Superior Strength and Durability: The scrim layer ensures that the towels are exceptionally strong, even when wet, reducing the risk of tearing or shedding during use.

•Lint-Free and Clean: In hospital environments, lint can compromise sterility. These towels are designed to remain lint-free, making them ideal for surgical hand paper needs.

Applications in Hospital and Surgical Settings

Hospitals demand products that perform flawlessly under pressure. Hospital hand paper towels with scrim reinforcement are indispensable for various tasks, including drying hands after washing, cleaning medical instruments, and wiping surfaces. Their strength and moisture resistance make them an excellent choice for surgical hand paper applications, ensuring that the highest hygiene standards are maintained.

The Telijie Advantage

When it comes to scrim reinforced hand paper, Telijie stands out as a trusted brand known for quality and innovation. Our products not only meet the rigorous demands of hospital and surgical environments but also come with additional benefits that set us apart:

•Customized Solutions: At Telijie, we understand that different medical facilities have unique needs. Our team works closely with clients to provide tailored products that align with specific requirements.

•Reliable Supply Chain: Hospitals and surgical centers depend on consistent and timely deliveries. Telijie ensures a seamless supply process, so you never run out of essential products.

•Expert Support: Beyond just providing exceptional products, Telijie offers dedicated customer service to address any concerns or special requests promptly.

Telijie’s scrim reinforced hand paper towels offer the perfect combination of strength, reliability, and eco-friendliness, making them an indispensable choice for hospital surgical use. Partner with us today and experience the unparalleled quality and service that only Telijie can provide.

CSCERAMIC Silicon Carbide Tubing: Revolutionizing Industrial Applications

Due to their excellent physical and chemical properties, silicon carbide tubes show a wide range of application potential in many industrial fields, especially in those industries that require materials to withstand high temperatures and corrosive environments. Its unique capabilities make CSCERAMIC ideal for efficient operation under extreme conditions.

Silicon Carbide Tubing: Core Applications in Aerospace

In the aerospace field, the application of silicon carbide tubes is particularly critical. In gas turbines and rocket engines, CSCERAMIC tubes, with their excellent thermal stability and mechanical strength, are ideal materials that can withstand extreme thermal stresses and maintain efficiency under high performance conditions. These characteristics ensure the safe operation of aircraft in high temperature and high pressure environments, further pushing the boundaries of aerospace technology.

Silicon Carbide Tubes: Innovating the Automotive Industry

With the continuous pursuit of high efficiency and low emission in the automotive industry, silicon carbide tubes are increasingly used in exhaust systems and heat exchangers. CSCERAMIC's silicon carbide tubes operate efficiently in high temperature environments, making them ideal for dealing with the challenges of harsh exhaust gas environments and thermal cycling. Its application not only improves the overall performance and durability of vehicles, but also provides important support for the green transformation of the automotive industry.

Boosting Energy Efficiency with Silicon Carbide Tubing in the Power Industry

In the power industry, silicon carbide tubes also play an indispensable role. In key areas such as heat exchangers and combustion chambers, CSCERAMIC's silicon carbide tubes ensure efficient heat transfer with their high thermal conductivity, which is critical for optimizing the power generation process and reducing energy loss. With the continuous improvement of global requirements for energy efficiency and sustainability, CSCERAMIC tubes will have a broader application prospect in the power industry, and its role in improving power generation efficiency and promoting the use of clean energy will become more prominent.

In summary, silicon carbide tube with its unique high temperature resistance, corrosion resistance, in aerospace, automotive industry and power industry and other fields to show outstanding application value. With the continuous progress of technology and the continuous development of the industry, the application range of CSCERAMIC silicon carbide tubes will continue to expand, and its role in promoting the upgrading of related industries and achieving efficient and sustainable development goals will become increasingly significant. In the future, CSCERAMIC will continue to contribute to the innovative development of various industries with its excellent performance.

The Importance of Free Testosterone Testing in Diagnosing Hormonal Disorders

Free testosterone testing plays a crucial role in enhancing the diagnostic capabilities for various androgen-related conditions, including hypogonadism, erectile dysfunction, and polycystic ovary syndrome (PCOS). Accurate measurement of free testosterone levels is essential for healthcare providers to assess and manage these conditions effectively, leading to improved patient outcomes.

Enhancing Free Testosterone Diagnostic Precision

The ability to diagnose androgen-related disorders hinges on understanding testosterone levels in the body. Conditions such as hypogonadism, characterized by insufficient testosterone production, and erectile dysfunction, often linked to hormonal imbalances, can significantly impact a patient's quality of life. By utilizing free testosterone testing, clinicians can obtain a clear picture of hormonal status, enabling more accurate diagnoses and tailored treatment plans. This approach is especially vital in cases where total testosterone levels may not provide.

Direct Quantification with ChLIA

The chemiluminescent immunoassay (ChLIA) method is a cutting-edge approach for the direct quantification of free testosterone in serum or plasma. This technique offers several advantages, including high sensitivity and specificity, allowing for reliable results even at lower testosterone levels. By employing ChLIA, laboratories can ensure that healthcare providers receive accurate measurements, leading to better-informed decisions regarding patient care.

Free testosterone testing is essential for diagnosing androgen-related disorders such as hypogonadism, erectile dysfunction, and PCOS. The implementation of advanced testing methods like ChLIA enhances the precision of free testosterone measurements, ultimately benefiting both patients and healthcare providers. As awareness of hormonal health grows, the importance of accurate and reliable testing will continue to play a pivotal role in effective diagnosis and management of these conditions. Reliable testing solutions can lead to better health outcomes and improved quality of life for patients.

 

Revolutionary Silicon Carbide Tubing for High-Temp Applications by CSCERAMIC

In the field of high-temperature applications, finding a material that can withstand extreme conditions without sacrificing performance has always been a major challenge for engineers. However, the emergence of silicon carbide tubes has brought a revolutionary solution to this problem, and it shows extraordinary adaptability and superiority in the toughest environments with its excellent performance.

 

The Unique Performance Advantages of Silicon Carbide Tubing

Silicon carbide tubes stand out as an innovative material for their excellent thermal conductivity, amazing strength and excellent corrosion resistance. These unique performance characteristics make it ideal for industries such as aerospace, automotive manufacturing and power generation, which are often tested by extreme temperatures and harsh conditions. CSCERAMIC's silicon carbide tubes, with their latest advances in materials science, provide unprecedented performance guarantees in these critical areas.

 

Silicon Carbide Tubing's Superior Performance in High-Temperature Environments

In extreme environments with temperatures as high as 1,650 degrees Celsius, CSCERAMIC's silicon carbide tubes demonstrated superior performance over traditional materials such as stainless steel and ceramics. Whether in gas turbines, heat exchangers or combustion chambers, this versatile material ensures optimal operation and extended service life of components. Its high temperature stability makes the silicon carbide tube an indispensable core component in high temperature environments.

 

Wide Applications and Industry Transformations with Silicon Carbide Tubing

The wide application of silicon carbide tubes is profoundly changing many industries. In aerospace, it improves the thermal efficiency and reliability of engines; In the automotive industry, it helps new energy vehicles achieve higher thermal management efficiency; In the power generation industry, the application of silicon carbide tubes significantly improves power generation efficiency and equipment durability. CSCERAMIC silicon carbide tube, with its wide application prospects and remarkable benefits, is gradually becoming a new benchmark for high temperature solutions.

 

CSCERAMIC Silicon Carbide Tubing: Leading the Future and Setting New Standards

With the progress of science and technology and the constant change of industrial demand, CSCERAMIC silicon carbide tube not only shows great potential in existing applications, but also continuously explores new application fields to promote the development of high-temperature material technology. It not only meets the current industrial demand for high-performance materials, but also sets new standards for future applications in extreme environments, leading the trend of innovation in the field of materials science.

 

In summary, CSCERAMIC silicon carbide tubes are an innovative solution for high-temperature applications due to their excellent performance, broad application prospects, and setting future standards. It can not only withstand the test of extreme conditions, but also continue to promote the technological progress and industrial upgrading of related industries. For fields seeking unmatched performance in extreme environments, CSCERAMIC's silicon carbide tubes are the material of choice, leading the way to a more efficient and reliable technological future.

CSCERAMIC Silicon Carbide Tubing: High-Temp, Strong & Corrosion-Resistant

In the modern industrial field, with the continuous progress of technology, the requirements for material properties are also increasing, especially in high temperature, high pressure and corrosive environments. As a high-performance material, silicon carbide tubes stand out in many industries with their unique advantages and become the preferred solution for high temperature applications. This article will explore the three core advantages of CSCERAMIC silicon carbide tubes: excellent thermal stability, excellent mechanical strength, and excellent corrosion resistance, to reveal why they can maintain efficient and stable performance under a variety of extreme conditions.

CSCERAMIC Silicon Carbide Tubing: Excellent Thermal Stability

One of the most significant advantages of CSCERAMIC silicon carbide tubes is their excellent thermal stability. Unlike traditional materials, silicon carbide can remain structurally intact at extreme temperatures of up to 1650 degrees Celsius without deformation. This ability to maintain performance at high temperatures significantly reduces the risk of failure in critical applications, thereby improving overall system safety and reliability. For industrial equipment that needs to withstand high temperature environment for a long time, CSCERAMIC silicon carbide tube is undoubtedly the ideal choice, it not only ensures the stable operation of the equipment, but also extends the service life of the equipment.

Mechanical Strength of CSCERAMIC SiC Tubing: Lightweight & Durable

In addition to thermal stability, another highlight of CSCERAMIC silicon carbide tubes is their excellent mechanical strength and lightweight characteristics. Silicon carbide tube is not only high strength, but also light weight, which makes it a significant advantage in weight-sensitive industries such as aerospace and automotive manufacturing. Its excellent durability means that it can effectively resist wear and maintain structural integrity even when faced with harsh operating environments such as thermal shock. This combination of high strength and lightweight not only extends the service cycle of the product, but also reduces maintenance costs, bringing significant economic benefits to manufacturers and users.

Corrosion Resistance of CSCERAMIC Silicon Carbide Tubes

The third core advantage of CSCERAMIC silicon carbide tubes is their excellent corrosion resistance. This characteristic is particularly important for industries dealing with corrosive substances or in extreme environmental conditions. Silicon carbide can effectively resist oxidation and chemical erosion, reducing the possibility of degradation of the material over time. Therefore, whether in high temperature environments or chemically aggressive occasions, CSCERAMIC silicon carbide tubes can maintain their original performance, showing high adaptability and durability, becoming a versatile solution for a variety of application scenarios.

In summary, CSCERAMIC silicon carbide tubes show remarkable performance in many high temperature, high pressure and corrosive environments with their excellent thermal stability, excellent mechanical strength and excellent corrosion resistance. It not only improves the safety and reliability of industrial equipment, but also brings significant economic value to users through lightweight design and durability advantages. With the continuous progress of technology and the continuous expansion of applications, CSCERAMIC silicon carbide tubes will undoubtedly play an irreplaceable role in more fields and become a key material to promote industrial upgrading and innovation.

Today, with the rapid development of the electronics industry, aluminum nitride ceramics have become the first choice for large-scale integrated circuit cooling substrates and packaging materials because of their excellent thermal conductivity, excellent mechanical properties, corrosion resistance and good electrical properties. Especially in the pursuit of miniaturization and high performance integrated circuit chips, the lightweight and ultra-smooth surface of aluminum nitride substrates become the key to improve the overall performance. However, the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics have brought great challenges to its ultra-precision machining. How to achieve surface roughness as low as nanometer level without damaging the material itself has become a technical problem to be solved urgently in scientific research and industry. This paper focuses on the magnetorheological polishing process of aluminum nitride ceramics, and discusses how to effectively deal with these challenges and achieve high quality flat machined surfaces.

 

Magnetorheological polishing technology, as an innovative ultra-precision machining method, cleverly combines magnetic field control and fluid mechanics principles to achieve non-contact or low contact stress polishing of material surfaces. By adjusting the intensity and distribution of the magnetic field, the arrangement and motion of the magnetic particles in the magnetorheological fluid are controlled to form a dynamic and controllable polishing film on the surface of the workpiece. This polishing film can remove tiny bumps on the surface of the material with extremely high accuracy and efficiency under very small contact pressure, achieving a surface roughness of nanometer level.

For aluminum nitride ceramics, magnetorheological polishing technology has shown significant advantages. First of all, since there is almost no direct contact in the polishing process, the mechanical and thermal stress that may be caused by traditional polishing methods is avoided, and the surface defects and sub-surface damage generated during the processing are significantly reduced. Secondly, magnetorheological polishing has a high degree of controllability. By precisely adjusting process parameters, such as magnetic field strength, polishing fluid flow rate and specimen speed, it can achieve accurate machining of aluminum nitride ceramic substrates of different shapes and sizes to meet diverse processing needs.

In addition, magnetorheological polishing technology also has a high material removal rate and processing efficiency. The results show that under suitable process conditions, magnetorheological polishing process of aluminum nitride ceramics can achieve surface accuracy of RMS value less than 2 nm, while maintaining high processing speed, which is of great significance for improving production efficiency and reducing production cost.

 

In summary, the magnetorheological polishing process of aluminum nitride ceramics, with its unique non-contact or low contact stress polishing mechanism, effectively overcomes the processing problems caused by high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics, and provides a new solution for obtaining high-quality flat machined surfaces. With the continuous maturity and optimization of technology, magnetorheological polishing technology is expected to show its great potential in more fields such as electronic packaging, optical components, precision machinery, and promote the development of related industries in the direction of higher precision and higher efficiency. In the future, we look forward to further expanding the application scope of magnetorheological polishing technology through continuous research and innovation, and contributing more to scientific and technological progress and social development.

In the field of microelectronic packaging, aluminum nitride ceramics are gradually becoming the preferred material for high-performance chip cooling substrates due to their excellent thermal conductivity, mechanical strength and electrical properties. However, its high hardness and high brittleness can easily cause surface micro-cracks and sub-surface damage during processing, which directly affect the final properties and application effects of the material. Therefore, how to optimize the chemical mechanical polishing (CMP) process of aluminum nitride ceramics to effectively reduce or eliminate these processing defects has become a hot and difficult point in current research.

 

Aluminum nitride ceramics, as a high-performance advanced material, with its excellent thermal conductivity efficiency (thermal conductivity up to about 200-300 W/m·K, far exceeding traditional ceramic materials), excellent mechanical properties (high hardness, high strength), excellent corrosion resistance, as well as good electrical insulation and weldability characteristics, It has shown great potential in the field of microelectronics, especially in the cooling substrate and packaging materials of large-scale integrated circuits (ics). AlN substrate’s lightweight design not only effectively reduces the volume and weight of electronic devices, but also significantly reduces thermal resistance through its ultra-smooth surface (ideal surface roughness Ra ≤ 8 nm, and even requires surface accuracy RMS < 2 nm after polishing), optimizing the heat dissipation efficiency of the chip, which is crucial to improving the overall performance and reliability of integrated circuits.

 

However, the high hardness (Mohs hardness of about 9), high brittleness and relatively low fracture toughness of aluminum nitride ceramics pose great challenges for precision machining, especially surface flattening. In the process of processing, it is easy to produce surface scratches, micro-cracks and other defects as well as difficult to detect sub-surface damage, which will directly affect the performance and service life of the material. Therefore, how to achieve efficient and high-quality aluminum nitride ceramic surface flattening processing and reduce processing defects has become a key problem to be solved in the field of materials science and engineering.

 

The core of the chemical mechanical polishing process of aluminum nitride ceramics is to realize the fine processing and flat treatment of the material surface through the dual action of chemical corrosion and mechanical friction. This process can not only significantly improve the surface roughness of the material, but also adjust the surface stress state of the material to a certain extent, so as to improve the overall performance. However, the traditional CMP process is often difficult to balance the processing efficiency and surface quality when processing aluminum nitride ceramics, especially in the prevention of micro-cracks and sub-surface damage.

 

It is worth noting that compared with more mature semiconductor materials such as silicon carbide, there are still some research gaps in the selection of abrasives, the types of polishing pads and the optimization process of aluminum nitride ceramics in CMP process. In the future, with the in-depth understanding of the characteristics of aluminum nitride ceramic materials and the continuous innovation of CMP technology, it is expected to develop a more efficient, environmentally friendly and suitable for aluminum nitride ceramics CMP process system, and further promote its wide application in the field of high-performance electronic packaging.

 

 

To solve the problem that the surface of aluminum nitride after processing is prone to micro-cracks and sub-surface damage, it is necessary to start from many aspects:

 

1. Optimize the formulation of polishing fluid: Develop polishing fluid with higher selectivity, which can more effectively remove the surface of the material without damaging its internal structure. At the same time, the pH value, concentration and additive types of the polishing liquid are adjusted to reduce the chemical erosion of aluminum nitride ceramics and reduce the risk of micro-cracks.

 

2. Improve the selection of polishing pads and abrasives: select polishing pads with moderate hardness and good wear resistance, as well as abrasive particles with uniform particle size distribution and regular shape to reduce mechanical stress concentration during processing and avoid sub-surface damage.

 

3. Precise control of polishing parameters: including polishing pressure, rotation speed, polishing time, etc. The reasonable setting of these parameters can directly affect the polishing effect and processing quality. By fine-tuning these parameters, it is possible to minimize surface defects while ensuring processing efficiency.

 

4. Adopt advanced detection and feedback technology: the online monitoring and feedback system is introduced in the CMP process to detect the quality of the machined surface in real time, and adjust the polishing parameters in time according to the feedback results to realize the intelligent and fine control of the processing process.

 

In summary, the optimization and improvement of chemical mechanical polishing process of aluminum nitride ceramics is the key to solve the micro-cracks and sub-surface damage of aluminum nitride surface after processing. Through the comprehensive application of the above strategies, the processing quality and application performance of aluminum nitride ceramics can be significantly improved, and the wide application and development of aluminum nitride ceramics in the field of microelectronics packaging can be promoted.

As a new inorganic nonmetallic material with high performance and multiple functions, transparent ceramics show great application potential in optics, electronics, aerospace and other fields because of its excellent light transmission, high strength, high hardness and good thermal and chemical stability. Among the many methods to prepare transparent ceramics, hot pressing sintering has become one of the key technologies to achieve high performance transparent ceramic materials because of its unique technological characteristics. The purpose of this paper is to discuss the application principle and technological advantages of hot pressing sintering technology in the preparation of transparent ceramics and its promoting effect on the development of materials science in the future.

 

 

The basic principle and process of hot pressing sintering

Hot press sintering technology through the powder or preliminary forming ceramic body placed in a high melting point metal or graphite mold, in a high temperature environment to apply a certain pressure to promote the close contact and diffusion of powder particles, so as to complete the sintering process in a short time. This process can not only improve the density of ceramics, but also effectively inhibit the abnormal growth of grains, and obtain transparent ceramic materials with fine grains and uniform structure.

 

Advantages of direct sintering of ceramic blanks

Hot pressing sintering technology can directly sintering the ceramic blank without complicated pretreatment, simplifying the production process, reducing energy consumption and cost. At the same time, because the pressure applied in the sintering process helps to eliminate the pores, improve the light transmission and mechanical strength of the ceramics, so that the prepared transparent ceramics have significant advantages in optical components, window materials and other applications.

 

Innovation of molding and sintering integration process

One of the highlights of this technology is the ability to combine the molding process with the sintering process, that is, to complete the sintering while applying pressure, which not only improves the production efficiency, but also reduces the defects that may be introduced due to multiple processing, ensuring the overall performance and consistency of the ceramic material. This integrated process is particularly important for the preparation of transparent ceramic parts with complex shapes and provides the possibility for precision manufacturing.

 

In summary, hot press sintering technology plays a crucial role in the development and production of transparent ceramic materials with its efficient and high-quality preparation characteristics. It not only optimizes the traditional sintering process, promotes the improvement of transparent ceramics performance and the reduction of cost, but also broadens the application field of transparent ceramics and lays a solid foundation. With the continuous deepening of material science research and continuous progress of technology, hot press sintering technology is expected to show its unique value in the preparation of more high-performance and multi-functional ceramic materials, and inject new vitality into the development of new materials industry. In the future, the exploration of more environmentally friendly and energy-saving hot press sintering new processes, as well as the development of new transparent ceramic materials with specific functions, will be the focus of research in this field.

With the rapid development of microelectronics technology, the requirements for electronic packaging materials are increasingly stringent. Aluminum nitride ceramics, with its excellent thermal conductivity, excellent mechanical properties, corrosion resistance and excellent electrical properties, become the leader of large-scale integrated circuit cooling substrate and packaging materials. However, the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics are like an insurmountable gap, which greatly challenges its application in the field of ultra-precision machining. Especially in the pursuit of ultra-smooth surface with surface roughness Ra ≤ 8 nm or even RMS < 2 nm, how to effectively reduce surface defects and sub-surface damage during machining has become a key problem restricting the wide application of aluminum nitride ceramics. In this context, ELID (Electrolytic in-process Dressing) grinding process offers innovative solutions to the processing challenges of AlN substrates with its unique advantages.

 

ELID grinding technology is a composite mirror processing technology that integrates traditional grinding, grinding and polishing. The core of ELID grinding technology is to realize dynamic self-sharpening during grinding through electrolytic in-situ dressing of grinding wheels, thus significantly improving grinding efficiency and processing quality. ELID grinding technology shows exceptional applicability for high-hardness brittle materials such as aluminum nitride ceramics.

Firstly, ELID grinding uses a weak electrolyte solution as the grinding fluid, which not only avoids the potential corrosion of the traditional grinding fluid on the machine tool and the workpiece, but also simplifies the processing environment and reduces the production cost. More importantly, this technology can effectively control the temperature during grinding, reducing workpiece burns, residual stresses and cracks caused by high temperatures, which is essential to protect the microstructure and properties of aluminum nitride ceramics.

Secondly, ELID grinding forms a uniform and dense oxide film on the surface of the grinding wheel through electrolysis, which not only improves the cutting ability of the grinding wheel, but also enhances the wear resistance of the grinding wheel, ensuring the stability and continuity of the grinding process. At the same time, by precisely controlling the correction current, the fine adjustment of the oxide layer thickness can be achieved, and then the grinding effect can be optimized, the surface roughness and sub-surface damage can be reduced, and the harsh requirements of aluminum nitride ceramics for ultra-smooth surfaces can be met.

In addition, ELID grinding technology also has the characteristics of simple process and flexible operation, which is easy to promote and apply in industrial production. Through continuous optimization of grinding parameters and process conditions, the processing efficiency and processing quality of aluminum nitride ceramics can be further improved to meet the growing demand for high-performance materials in the field of microelectronics packaging.

 

In summary, ELID grinding process, with its unique advantages, has shown great potential in solving the processing problems caused by high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics. Through this technology, not only can effectively reduce the surface defects and sub-surface damage in the processing process, but also significantly improve the processing efficiency and processing quality, which lays a solid foundation for the wide application of aluminum nitride ceramics in the field of electronic packaging. In the future, with the continuous development and improvement of ELID grinding technology, it is believed that its application prospects in the field of ultra-precision machining will be broader, and contribute to the continuous progress of microelectronics technology.

In today's rapidly changing electronics industry, ceramic substrate materials as a key basis for supporting high-performance electronic devices, its performance and characteristics directly affect the overall performance and reliability of electronic products. From the early alumina ceramics to the later aluminum nitride, silicon nitride and other new materials, the development of ceramic substrate materials has witnessed the continuous progress and innovation of science and technology. This article will take you to explore the unique advantages and application prospects of these ceramic substrate materials, especially how aluminum nitride and silicon nitride ceramics stand out in the solution of high-power device heat dissipation and high-intensity heat dissipation environment with their excellent performance, and become an indispensable important material in the modern electronics industry.

 

Alumina substrate, as the pioneer of ceramic substrate, has been successfully developed by Siemens in Germany since 1929 and entered industrial production in 1933, with its low price, excellent stability, good insulation and mechanical properties, has long occupied a dominant position in a wide range of applications. However, its relatively low thermal conductivity and thermal expansion coefficient that do not match Si limit its further development in high-power electronic products, and it is mainly used in the field of low-voltage and low-integration circuit packaging.

 

Subsequently, although BeO substrates stood out for its high thermal conductivity, the toxicity problem became an insurmountable obstacle, which was not only banned in Japan, but also severely restricted in Europe, greatly hindering its wide application.

 

In contrast, although the SiC single crystal has an amazing thermal conductivity, the thermal conductivity of polycrystalline SiC ceramics decreases significantly due to the difference in grain orientation, coupled with poor insulation performance and high dielectric loss, which makes the research progress in the field of circuit board materials slow.

 

Under this background, aluminum nitride and silicon nitride ceramics are gradually emerging with their unique performance advantages. Aluminum nitride substrate with its excellent high thermal conductivity (theoretical value up to 320W/ (m·K), commercial product thermal conductivity is also between 180W/ (m·K) ~260W/ (m·K)) has become a key material to solve the heat dissipation problem of high-power devices, and since the 1980s, under the promotion of developed countries, especially Japan, It has rapidly developed into a new generation of advanced ceramic packaging materials. Its high mechanical strength and chemical stability ensure stable operation in harsh environments.

 

 

Silicon nitride substrates, after experiencing the early stage of underestimated thermal conductivity, through scientific research and process optimization, its thermal conductivity has been significantly improved, breaking through 177W/ (m·K), while maintaining a very low coefficient of thermal expansion (3.2×10−6/℃), becoming one of the most excellent ceramic substrate materials with comprehensive performance. Its excellent bending strength and wear resistance show extraordinary competitiveness in high intensity heat dissipation environment.

 

 

In summary, aluminum nitride ceramics are the best choice for heat dissipation of high-power devices due to their high thermal conductivity and thermal expansion coefficient matching semiconductor materials. Silicon nitride ceramics, with their comprehensive performance advantages, lead the way in demanding thermal environments. Together, the two lead the ceramic substrate materials to higher performance and a wider range of applications.